Contactless Integrated Systems for “More than Moore” Applications
Speaker: Vasilis F. Pavlidis
Advanced Processor Technologies group, University of Manchester, UK
Abstract: The idea of ubiquitous computing with 30 billion connected devices in service by 2020, ranging from micro-scale biomedical implanted chips, to portable and wearable electronics, and high performance data centres, has become an ambitious objective of this decade. Building such a diverse and complex ecosystem requires integration strategies that go beyond traditional objectives, for example, speed and area and enable new features, such as technological and functional heterogeneity, reusability, and disposability.
This talk discusses a low cost, low form-factor and energy efficient integration technology where the classic wired interconnections are replaced by contactless links deployed to underpin low power applications, such as lab-on-chip systems. The advantages over the state-of-the-art, typically based on conventional wired interconnects, and the challenges for delivering these systems are described along with a methodology for the energy efficient design of these systems by exploiting heterogeneous CMOS processes. Additional considerations including cost, design tools, and modeling processes are also presented, highlighting all the diverse aspects of the ecosystem that need to be addressed towards the high volume manufacturing of contactless integrated systems.
Short biography: Vasilis Pavlidis is an Associate Professor in the School of Computer Science at the University of Manchester, UK. He holds an MSc and PhD degree from the University of Rochester, Rochester, NY, obtained in 2003 and 2008, respectively, all in Electrical and Computer Engineering. From 2008 to 2012, he was a post-doctoral researcher at the Integrated Systems Laboratory of EPFL, Switzerland. His research interests are in the area of interconnect modeling and analysis, 3-D integration, and other issues related to VLSI design. He serves as an Associate Editor of the IEEE Transactions on VLSI, the Microelectronics Journal, and Integration, the VLSI Journal. He is a Senior Member of the IEEE and the Publicity chair of the IEEE Council on EDA. He is the leading author of the book Three-Dimensional Integrated Circuit Design (1st and 2nd Ed.).